Flow Simulation: Electronic Cooling Module

The Electronic Cooling Module for SOLIDWORKS Flow Simulation evaluates standard components’ thermal properties and cooling requirements. Comprising of both analysis productivity tools and enhanced simulation functionality, the Electronic Cooling Module is a key tool for designers of electronic packaging.

In stock

Capabilities

Electronic Cooling

The Electronic Cooling Module uses dedicated electronic thermal models created through SOLIDWORKS computational fluid dynamics (CFD) to predict airflow, temperature, and heat transfer in components, boards, and complete products.


Fluid Flow Analysis

Determine the impact of a liquid or gas on product performance during the design phase using CAD-embedded SOLIDWORKS Flow Simulation. Computational fluid dynamics (CFD) studies provide meaningful insight into the impact of fluid flow, so you can address problems early, reduce the need for costly prototypes, and eliminate rework.


Electronics Thermal Management

Product Engineers can import thermal properties from CircuitWorks™ ECAD files to SOLIDWORKS Flow Simulation, including dielectric and conductor density, specific heat, conductivity for PCBs, and volumetric heat sources from components. This capability facilitates setting up the CFD analysis for cooling simulation of electronic components to define PCBs and heat sources.

Matrix


SOLIDWORKS Flow Simulation

SOLIDWORKS Flow Simulation

(HVAC)

SOLIDWORKS Flow Simulation

(Electric Cooling)

Ease of Use/Intuitiveness/Concurrent Engineering

Fully Embedded in SOLIDWORKS 3D CAD

Local and Worldwide Support Services

Support SOLIDWORKS Configurations

Flow Conditions

2D/3D Flow



Sector Periodicity



Internal & External Fluid Flow



Steady-state Fluid Flow



Time-dependent Fluid Flows



Combustible Mixtures



Mixed Flows



Separated Flows – Fluid Sub-domains



Compressible Gas and Incompressible Fluids



Subsonic, Transonic and Supersonic Flow



Free, Forced and Mixed Convection



Laminar and Turbulent Fluid Flows



Porous Media



Fluid Flows in the Models with Moving and Rotating Surfaces



Heat Conduction in Fluid, Solid and Porous Media with/without Conjugate Heat Transfer and/or Contact Heat Resistance between Solids



Heat Conduction in Solids Only



Gravitational Effects

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Radiation Heat Transfer Between Solids

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Heat Sources due to Peltier Effect

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Joule Heating due to Direct Electric Current in Electrically Conducting Solids

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Real Gases

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Cavitation in Incompressible Water Flows

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Equilibrium Volume Condensation of Water from Steam and its Inuence on Fluid Flow and Heat Transfer

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Two-phase (Fluid + Particles) Flows

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Relative Humidity in Gases and Mixtures of Gases

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Tracer Study

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Comfort Parameters

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Heat Pipes/Thermal joints/Two-resistor Components

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