Products Simulation and Flow SOLIDWORKS Flow Simulation: Electronic Cooling Module

SOLIDWORKS Flow Simulation: Electronic Cooling Module

Optimize the cooling strategy for electronic components concurrent to the design process using the Electronic Cooling Module. Add-in to SOLIDWORKS Flow Simulation.

The Electronic Cooling Module for SOLIDWORKS Flow Simulation evaluates standard components’ thermal properties and cooling requirements. Comprising of both analysis productivity tools and enhanced simulation functionality, the Electronic Cooling Module is a key tool for designers of electronic packaging.


The electronics cooling module for SOLIDWORKS Flow Simulation provides additional detail to those working with the thermal management of electronics componentry and enclosures. It allows you to analyze electronic packages as two-resistor thermal models, allows for detailed specification of PCB layer composition and thermal makeup, provides a model for representing heat sinks, and allows calculation of joule heating due to electrical inputs.

  • Quickly and accurately model complex electronic systems for thermal analysis
  • Ease of simulating fluid flow, heat transfer, and fluid forces that are critical to the success
  • Enables you to model heat pipes simply and effectively
  • Maximum analysis productivity
  • Deliver unrivaled ease of use, power, and productivity
  • Industry specific features


Electronic Cooling

The Electronic Cooling Module uses dedicated electronic thermal models created through SOLIDWORKS computational fluid dynamics (CFD) to predict airflow, temperature, and heat transfer in components, boards, and complete products.

Fluid Flow Analysis

Determine the impact of a liquid or gas on product performance during the design phase using CAD-embedded SOLIDWORKS Flow Simulation. Computational fluid dynamics (CFD) studies provide meaningful insight into the impact of fluid flow, so you can address problems early, reduce the need for costly prototypes, and eliminate rework.

Electronics Thermal Management

Product Engineers can import thermal properties from CircuitWorks™ ECAD files to SOLIDWORKS Flow Simulation, including dielectric and conductor density, specific heat, conductivity for PCBs, and volumetric heat sources from components. This capability facilitates setting up the CFD analysis for cooling simulation of electronic components to define PCBs and heat sources.


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  • solidworks flow simulation datasheet

    SOLIDWORKS Flow Simulation Datasheet


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