Flow Simulation: Electronic Cooling Module
The Electronic Cooling Module for SOLIDWORKS Flow Simulation evaluates standard components’ thermal properties and cooling requirements. Comprising of both analysis productivity tools and enhanced simulation functionality, the Electronic Cooling Module is a key tool for designers of electronic packaging.
Electronic Cooling
The Electronic Cooling Module uses dedicated electronic thermal models created through SOLIDWORKS computational fluid dynamics (CFD) to predict airflow, temperature, and heat transfer in components, boards, and complete products.
Fluid Flow Analysis
Determine the impact of a liquid or gas on product performance during the design phase using CAD-embedded SOLIDWORKS Flow Simulation. Computational fluid dynamics (CFD) studies provide meaningful insight into the impact of fluid flow, so you can address problems early, reduce the need for costly prototypes, and eliminate rework.
Electronics Thermal Management
Product Engineers can import thermal properties from CircuitWorks™ ECAD files to SOLIDWORKS Flow Simulation, including dielectric and conductor density, specific heat, conductivity for PCBs, and volumetric heat sources from components. This capability facilitates setting up the CFD analysis for cooling simulation of electronic components to define PCBs and heat sources.
| SOLIDWORKS Flow Simulation | SOLIDWORKS Flow Simulation (HVAC) | SOLIDWORKS Flow Simulation (Electric Cooling) | |
| Ease of Use/Intuitiveness/Concurrent Engineering | |||
| Fully Embedded in SOLIDWORKS 3D CAD | x | x | x |
| Local and Worldwide Support Services | x | x | x |
| Support SOLIDWORKS Configurations | x | x | x |
| Flow Conditions | |||
| 2D/3D Flow | x | ||
| Sector Periodicity | x | ||
| Internal & External Fluid Flow | x | ||
| Steady-state Fluid Flow | x | ||
| Time-dependent Fluid Flows | x | ||
| Combustible Mixtures | x | ||
| Mixed Flows | x | ||
| Separated Flows – Fluid Sub-domains | x | ||
| Compressible Gas and Incompressible Fluids | x | ||
| Subsonic, Transonic and Supersonic Flow | x | ||
| Free, Forced and Mixed Convection | x | ||
| Laminar and Turbulent Fluid Flows | x | ||
| Porous Media | x | ||
| Fluid Flows in the Models with Moving and Rotating Surfaces | x | ||
| Heat Conduction in Fluid, Solid and Porous Media with/without Conjugate Heat Transfer and/or Contact Heat Resistance between Solids | x | ||
| Heat Conduction in Solids Only | x | ||
| Gravitational Effects |
| X | |
| Radiation Heat Transfer Between Solids |
| X | X |
| Heat Sources due to Peltier Effect |
| X | |
| Joule Heating due to Direct Electric Current in Electrically Conducting Solids |
| X | |
| Real Gases | x | ||
| Cavitation in Incompressible Water Flows | x | ||
| Equilibrium Volume Condensation of Water from Steam and its Inuence on Fluid Flow and Heat Transfer | x | ||
| Two-phase (Fluid + Particles) Flows | x | ||
| Relative Humidity in Gases and Mixtures of Gases | x | ||
| Tracer Study |
| x | |
| Comfort Parameters |
| x | |
| Heat Pipes/Thermal joints/Two-resistor Components |
| x | |
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